4th International Conference on

Disruptive Technologies
Tech Ethics and
Artificial Intelligence

(DiTTEt 2024) – Virtual version

July 3 – 5, 2024, Salamanca (Spain)

The 4th International Conference on disruptive technologies, tech ethics and artificial intelligence (DiTTEt) aims to bring together leading experts in the field of technology with global experts in the ethics of new technologies.

Conference Scope

DiTTEt provides a forum to present and discuss the latest scientific and technical advances and their implications in the field of ethics. Also provide a forum for experts to present their latest research in disruptive technologies, promoting knowledge transfer. It provides a unique opportunity to bring together experts in different fields, academics and professionals to exchange their experience in the development and deployment of disruptive technologies, artificial intelligence, their ethical problems.

DiTTEt intends to bring together researchers and developers from industry, humanities and academia to report on the latest scientific advances and the application of artificial intelligence as well as its ethical implications in fields as diverse as climate change, politics, economy or security in today’s world.

The DITTET 2024 conference will be held in hybrid mode. Authors who wish to do so will be able to give their presentation at the conference virtually. If the epidemiological situation permits, authors who wish to attend in a physical form will be able to present their work in a hybrid environment with live broadcast.

Important Dates

Submission deadline: 30 April 2024

Notification of acceptance: 24 May 2024

Camera-Ready papers: 31 May 2024

Registration deadline: 1 June 2024

DiTTEt 2024 Celebration: 3-5 July 2024

Publication

Accepted papers will be included in DITTET Proceedings, published by Springer.

At least one of the authors will be required to register and attend the symposium to present the paper in order to include the paper in the conference proceedings. All accepted papers will be published by Springer in the Advances in Intelligent Systems and Computing.

Organizers

Collaborates